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| The LDJ Series surface mount, IC style DIP switch uses J-Bend style terminals to reduce the board footprint. Insert molded terminals and an ultrasonic welded body enable flux washing the whole switch (if top tape sealed). Gold terminal plating helps ensure an excellent solder bond even after an extended shelf life. Packaging options include tubes and tape and reel for machine placement. You may also be interested in gull wing surface mount (LDM Series), half-pitch surface mount (LDH Series), and through-hole mount (LDI Series) versions. |
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| Specifications |
| Rating |
Steady: 100mA 50VDC
Switching: 25mA 24VDC |
| Electrical Life |
2,000 Cycles Min. at 25mA 24VDC |
| Contact Resistance |
Initial: 50mΩ Max.
After Life: 100mΩ Max. |
| Insulation Resistance |
100MΩ Min. at 500VDC |
| Dielectric Strength |
500VAC for 1 Minute |
| Capacitance |
5pF Max. |
| Operation Force |
1,000gf Max. |
| Vibration Test |
Mil-Std-202F Method 201A
Frequency: 10-55-10Hz / 1 Minute
Direction: X, Y, Z
Time: 2 Hours Each Direction
High Reliability |
| Shock Test |
Mil-Std-202F Method 213B Condition A
Gravity: 50G, 11 msec.
Direction: 6 Sides
Times: 3 Each Direction
High Reliability |
| Temperature Range |
Operating: -20°C to 85 °C
Storage: -40°C to 85°C |
| Soldering |
IR Reflow/Vapor Phase: 260°C Max. |
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| Popular/Stocking Part Numbers |
| Part Number | Stocking | Spec | Positions | Terminals | Description |  | | | | | | | LDJR-04-T-B | Y |  |  | 4 | SMT | Tape Sealed, Recessed Actuator, Tube Packaging
| | LDJR-08-T-B | Y | | | 8 | SMT | Tape Sealed, Recessed Actuator, Tube Packaging
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